The aggressive scaling plan allocates 700,000 wafers to memory production and over 300,000 to logic chips. The memory output alone would rival Samsung's estimated DRAM capacity of 650,000 to 700,000 wafers monthly, though Terafab's mix may include NAND. For logic, Jiji Press reports Terafab is pursuing Intel's 2nm and 1.4nm process nodes, while technical partnerships for memory production remain undisclosed.

Despite industry skepticism regarding the timeline—which typically requires over three years from planning to volume at the leading edge—signed NDAs at SEMICON West signal real momentum. If realized, this fab capacity would drastically reshape supply chains for enterprise AI accelerators, server infrastructure, and custom silicon.